Wave soldering in a reducing atmosphere

Details Wave soldering in a reducing atmosphere Wave soldering in a reducing atmosphere

1983-08-01

1985-09-03

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228220, 228 37, B23K 108, H05K 334

Patent

active

045387575

ABSTRACT:
Wave soldering is accomplished in an enclosure having an atmosphere which is substantially free of oxygen and which provides a fluxing action due to the presence of a gaseous reducing agent. A conveyor carries articles to be soldered through the enclosure by means of an entrance and exit which are provided with gas curtains to inhibit atmosphere exchange with the ambient air.

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patent: 4294395 (1981-10-01), Nayar
patent: 4320865 (1982-03-01), Batinovich
patent: 4383723 (1983-05-01), Schleimann-Jenson

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