Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1991-02-22
1993-01-05
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 42, 118DIG7, B23K 300, B23K 308
Patent
active
051763079
ABSTRACT:
A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.
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Diamantopoulous David A.
Hagerty Lawrence J.
Nowotarski Mark S.
Heinrich Samuel M.
Kent Peter
Praxair Technology Inc.
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