Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1991-10-03
1992-06-16
Heinrich, Samuel M.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228223, 228232, B23K 100
Patent
active
051218755
ABSTRACT:
A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.
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Diamantopoulous David A.
Hagerty Lawrence J.
Nowotarski Mark S.
Heinrich Samuel M.
Kent Peter
Union Carbide Industrial Gases Technology Corporation
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