Wave soldering bath

Details Wave soldering bath Wave soldering bath

2011-08-02

2011-08-02

Le, Emily (Department: 1734)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S033000, C228S260000

Reexamination Certificate

active

07988030

ABSTRACT:
In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body.In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.

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Shuichi Ono, “SP nitriding for long life of stainless soldering pot in Pb-free soldering”, Journal of Advanced Science, vol. 16, No. 2 (Aug. 31, 2004), pp. i-5 to i-7.
Yoshinobu Anbe and Akiko Anbe, “Namari-free Flow Sochi Sentei Joken” (“Selection Criteria for Lead-Free Flow Equipment”), Jisso Gijutsu Guide Book 2004, Denshi Zairyo 7 Gatsugo Bessatsu (May 29, 2004), pp. 127 to 131.

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