Wave soldering apparatus and process

Details Wave soldering apparatus and process Wave soldering apparatus and process

1994-05-31

1996-04-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 37, 228219, 228260, H05K 334

Patent

active

055095984

ABSTRACT:
A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.

REFERENCES:
patent: 4375271 (1983-03-01), Tsuchikura
patent: 4433805 (1984-02-01), Kanno
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5297724 (1994-03-01), Mehta et al.
patent: 5409159 (1995-04-01), Connors et al.
R. J. Klein Wassink, "Soldering in Electronics", Electrochemical Publications Limited, 2nd Edition, Chapter 9.2, pp. 483-489, (1989).

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