Metal fusion bonding – Process – Plural joints
Patent
1981-11-18
1984-08-07
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228260, 228 37, B23K 108, H05K 334
Patent
active
044638914
ABSTRACT:
An apparatus for wave soldering component leads to a conductor on a printed circuit board surface includes a fountain for forming a standing wave of hot molten solder. A pool of hot oil having a specific gravity lower than the solder floats in a depression in the surface of the solder adjacent to the standing wave. A printed circuit board whose surface is to be soldered is passed through the crest of the molten solder standing wave and then while the solder adhering to the component leads and conductor is still molten, into contact with the pool of hot oil.
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"Automatic Soldering Systems," Hollis Engineering, Inc., Catalog No. 168, pp. 4, 5, 7, 8, and 10.
"TDC TDS TDB Automatic Soldering System Operating Manual," Hollis Engineering Inc., Bulletin No. TDS-1075, pp. I-3, I-5, I-11, I-15, II-7, II-12, III-2, III-3.
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Berkshire Jon B.
Scheible Howard G.
Godici Nicholas P.
Haas George E.
Hodak Marc
RCA Corporation
Squire William
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