Wave solder weir arrangement with constant solder head

Details Wave solder weir arrangement with constant solder head Wave solder weir arrangement with constant solder head

1984-09-26

1986-02-04

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 37, B23K 100

Patent

active

045680167

ABSTRACT:
Parts (10) to receive a thin strip of solder are advanced along top surfaces of a pair of upwardly inclined channel plates (26, 27). Pressurized solder (31) is pumped between the plates to a precise head which projects as a meniscus (28) above the top surfaces of the channel members and is deposited on the advancing parts. The head of solder is maintained at a height to insure a partial flow of solder through a V-shaped trough (51). Any fluctuations in the height of head of solder is rapidly compensated by an increased or decreased flow of solder through the trough. A significant reservoir of solder is maintained between the channel plates so that the solder is held at a substantially constant temperature.

REFERENCES:
patent: 3151592 (1964-10-01), Wegener
patent: 3158171 (1964-11-01), Eckert
patent: 3989180 (1976-11-01), Tardoskegyi
S. Kostick, J. R. Murray and R. J. Noreika,--Wave Solder Chimney, IBM Technical Disclosure Bulletin--vol. 22, No. 9, Feb. 1980, pp. 3984 & 3985.

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