Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1994-09-26
1995-10-03
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
118406, B23K 300
Patent
active
054545056
ABSTRACT:
An apparatus for facilitating wave solder treatment and other handling of a circuit component during manufacture of the circuit component having first areas configured for wave solder treatment and second areas not configured for wave solder treatment. The apparatus comprises a substantially rigid frame generally symmetrical about a plane and defining an opening which traverses the frame intermediate a first side and a second side. The apparatus further comprises a masking member affixed to the frame and defining a plurality of apertures traversing the masking member to the opening in the frame. The apparatus also comprises a holding device for holding the circuit component in an operational location in fixed relation with the masking member and with the frame during wave solder treatment. Each of the first areas of the circuit component is substantially in register with an aperture of the masking member when the circuit component is in the operational location. Particular walls about the apertures have a ramp for affecting solder flow during wave solder treatment.
REFERENCES:
patent: 2964007 (1960-12-01), Buffington
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4421265 (1983-12-01), Boyer et al.
patent: 4506820 (1985-03-01), Brucker
patent: 4739919 (1988-04-01), Van Den Brekel et al.
Heinrich Samuel M.
Paragon Electric Company, Inc.
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