Metal fusion bonding – Process – Plural joints
Patent
1996-07-26
1998-07-07
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228260, H05K 334
Patent
active
057755680
ABSTRACT:
A method for wave soldering comprises the steps of providing a circuit board having a plurality of electronic components thereon and providing a pallet comprising a frame, first and second parallel rails attached to the frame, and third and fourth rails for receiving the circuit board. The third and fourth rails are attached to the first and second rails and the third and fourth rails form an angle of between about 30.degree. and 60.degree. with the first and second rails. Next, a solder wave is provided which generally flows in a first direction. Finally, the pallet is moved in a second direction generally perpendicular with the first direction across the solder wave. The components are therefore positioned at an angle with respect to the solder wave and solder-related electrical defects are reduced.
REFERENCES:
patent: 5024370 (1991-06-01), Yakota
patent: 5067433 (1991-11-01), Doll, Jr. et al.
patent: 5067648 (1991-11-01), Caseini
patent: 5540376 (1996-07-01), Asla et al.
Research Disclosure-March 1992 No. 335-57, Kenneth Mason Publications Ltd, England.
Asla Jess
Despain Ron
Lange Roy
Heinrich Samuel M.
Micron Custom Manufacturing Services Inc.
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