Wave solder machine

Metal fusion bonding – Process – Plural joints

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 37, 228 40, H05K 334, B23K 102

Patent

active

041391438

ABSTRACT:
A wave solder machine is provided which includes an endless moving mesh belt that is made of a nonsolderable material such as titanium wire. The belt is supported so as to be totally immersed in the solder wave as it passes the latter. This causes the undersides of stuffed printed circuit boards on the belt to be brought into contact with the molten solder. The belt wires preferably have a plurality of projections thereon to support the circuit boards above the major portion of the belt. In another machine, the circuit boards are moved along a plurality of parallel wires that pass through the solder wave. Alternatively, the wires themselves may be moving for carrying circuit boards across the solder wave.

REFERENCES:
patent: 2993272 (1961-07-01), Carlzen et al.
patent: 3421211 (1969-01-01), Eaves et al.
patent: 3655173 (1972-04-01), Costello
patent: 3825994 (1974-07-01), Coleman
"Special Flat-Flex Wire Belts for Continuous Processing," Catalog 72, Wire Belt Co. of America, 1972.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wave solder machine does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wave solder machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wave solder machine will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-687546

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.