Wave solder finger shield apparatus

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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228 37, B23K 108, B23K 3706

Patent

active

047170646

ABSTRACT:
A set of titanium guide bars are shaped with inner angular finger shields to isolate designated underside edge areas of a printed circuit board being conveyed across a molten solder bath in a wave solder machine.

REFERENCES:
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 3616984 (1971-11-01), Voroba
patent: 3849870 (1974-11-01), Cobaugh et al.
patent: 4447001 (1984-05-01), Allen et al.
patent: 4527731 (1985-07-01), Kent et al.
patent: 4545520 (1985-10-01), Kent
Amir-Hamzeh, E., "Fixtureless Wave Solder Conveyer System", IBM Technical Disclosure Bulletin, vol. 27, No. 6, Nov. 1984, pp. 3416-3417.

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