Wave-like structures bonded to flat surfaces in unitized...

Details Wave-like structures bonded to flat surfaces in unitized... Wave-like structures bonded to flat surfaces in unitized...

2011-06-07

2011-06-07

Tolin, Michael A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S085000, C156S206000

Reexamination Certificate

active

07955455

ABSTRACT:
A simplified manufacturing technique to directly form a unitized composite structure with at least one relatively flat surface and at least one sinuous element in an internally-bonded unitized composite is provided. A matrix of fibrous and or other materials is deposited in layers which are subsequently formed into corrugated or wave-like shapes and exposed to an activation step. At least one element is composed of a contractive material which shrinks when activated, such as by heating in an oven, to become relatively flat and optionally bonded to at least one other non-contractive layer which remains in a sinuous shape after the activation step.

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Abstract from Patent Abstracts of Japan and Machine Translation for JP 2004-169235 A. Date Unknown.

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