Waterproof connection method for covered wire with resin encapsu

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29868, 174 84R, H01R 4300

Patent

active

055841228

ABSTRACT:
In the covered-wire connection method and structure in which at least one of members to be conductively connected to each other is a covered wire comprising a conductive wire portion and a cover portion of resin which is coated around the outer periphery of the conductive wire portion, both of the members are overlapped with each other at connection portions thereof, the overlapped connection portions are pinched between a pair of resin chips, and then the cover portion are melted and dispersed by ultrasonic vibration while pressing the connection portions of the members from the outside of the resin chips to conductively connect both of the members to each other at the connection portions thereof. Thereafter, the pair of the resin chips are melted to be fixed to each other, so that the connection portions are sealed with the melted resin chips.

REFERENCES:
patent: 2250156 (1941-07-01), Ferguson
patent: 3418444 (1968-12-01), Ruehlemann
patent: 4878969 (1989-11-01), Janisch

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Waterproof connection method for covered wire with resin encapsu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Waterproof connection method for covered wire with resin encapsu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Waterproof connection method for covered wire with resin encapsu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1983171

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.