Water soluble soldering preflux and method of application

Details Water soluble soldering preflux and method of application Water soluble soldering preflux and method of application

1991-10-31

1992-07-07

Rowan, Kurt

Metal fusion bonding

Process

Plural joints

228207, 228223, 148 23, 148 25, B23K 120, B23K 35365

Patent

active

051275716

ABSTRACT:
Water soluble soldering preflux compositions are shown which include gum arabic, modified polysaccharides and other natural resins as a carrier, an oxidation inhibitor and water. The compositions are useful in the assembly of precisely aligned electrical components during multiple step, electronic card assembly techniques. Use of the preflux compositions according to the method of the invention permits a flexible, site-specific method for joining electronic components to a printed circuit board with a fewer number of steps.

REFERENCES:
patent: 5009724 (1991-04-01), Dodd et al.

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