Water-soluble soldering paste

Details Water-soluble soldering paste Water-soluble soldering paste

1991-01-28

1991-12-03

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, 2281801, 228207, B23K 3534

Patent

active

050697307

ABSTRACT:
A water soluble solder paste, which does not adversely impact the surface insulation resistance (SIR) of a circuit board, is comprised of powdered solder, a water soluble flux (containing an activator within a water soluble vehicle), a hydrophobic surfactant preferentially absorbed over the water soluble vehicle, and a solvent within which the surfactant and flux are dissolved. The hydrophobic surfactant is chosen to be preferentially absorbed by the circuit board surface over the water soluble flux vehicle to prevent the vehicle, which is hydrophilic from becoming trapped in the board surface, thereby adversely affecting the board SIR.

REFERENCES:
patent: 3977916 (1976-08-01), Stayner
patent: 4342607 (1982-08-01), Zado
patent: 4460414 (1984-07-01), Hwang
patent: 4648547 (1987-03-01), Mahler et al.
patent: 4701224 (1987-10-01), Zado
patent: 4872298 (1989-10-01), Jacobs
patent: 5009724 (1991-04-01), Dodd et al.

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