Water-soluble soldering paste

Details Water-soluble soldering paste Water-soluble soldering paste

1990-10-31

1992-08-25

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 25, 228223, B23K 3534

Patent

active

051415682

ABSTRACT:
A non-toxic, non-corrosive water-soluble soldering paste comprises at least about 80 wt % of particulate solder and the balance a thixotropic flux base. The flux base has a viscosity of at least about 200,000 cp and comprises (a) a botanical oil, (b) an aqueous emulsion of a thickening agent, such as corn starch or an ethoxylated linear alcohol in water, and (c) an organic acid having at least two carboxylic acid groups, such as citric acid. The paste of the invention produces solder joints of high metallic luster and excellent quality. Clean-up of paste residues is ac complished using only water.

REFERENCES:
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patent: 3684533 (1972-08-01), Conwicke
patent: 3925112 (1975-12-01), Petersen
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patent: 4290824 (1981-09-01), Cole
patent: 4342606 (1982-08-01), Notton
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patent: 4738732 (1988-04-01), Anderson et al.
patent: 4759490 (1988-07-01), Ochiai
patent: 4872928 (1989-10-01), Jacobs
Anderson, et al., filed Apr. 11, 1989, "Method And Composition For Protecting And Enhancing The Solderability Of Metallic Surfaces"Serial Number: 07/336,178.

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