Water soluble soldering flux

Details Water soluble soldering flux Water soluble soldering flux

1990-05-09

1991-02-19

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

049941194

ABSTRACT:
A water soluble soldering flux is shown which includes gum arabic, modified polysaccharides and other natural resins as the carrier, an organic activator and water. The carrier provides a tacky, yet fluid medium capable of holding precisely aligned electrical components during solder reflow and allows aqueous removal of the flux after reflow. The flux composition can be used to solder precisely aligned integrated circuit chips onto a circuit board.

REFERENCES:
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patent: 3925112 (1975-12-01), Petersen, Sr. et al.
patent: 3944123 (1976-03-01), Jacobs
patent: 4278479 (1981-07-01), Anderson et al.
patent: 4441938 (1984-04-01), Poliak et al.
patent: 4661173 (1987-04-01), Barajas et al.
patent: 4701224 (1987-10-01), Zado
patent: 4738732 (1988-04-01), Anderson et al.
patent: 4752027 (1988-06-01), Gschwend
J. Lamoureux, C. Morand and B. Pottier, "Used Electronic Module Pin Solder Dress Process", IBM Technical Disclosure Bulletin, vol. 24, No. 10, Mar. 1982.

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