Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1990-05-15
1992-02-04
Ramsey, Kenneth J.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228207, B23K 120
Patent
active
050853651
ABSTRACT:
A non-toxic, non-corrosive liquid soldering flux is provided, comprising an organic acid, such as citric acid, and a non-toxic carrier, such as water. This unique flux produces solder joints of high mettalic luster and excellent quality. Disposal presents no health hazards, and clean-up of flux residues is accomplished using only water.
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Anderson, et al., filed Apr. 11, 1989, "Method and Composition for Protecting and Enhancing the Solderability of Metallic Surfaces".
Daubenspeck William C.
Denson-Low Wanda K.
Hughes Aircraft Company
Ramsey Kenneth J.
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