Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Reexamination Certificate
2006-07-04
2006-07-04
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
C228S214000, C228S223000, C148S023000
Reexamination Certificate
active
07070085
ABSTRACT:
An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. After deposition the layer is dried until a solid protective film is obtained. An additional advantage obtained by the present invention is that the protective layer can be deposited also by means of an offset printing process, avoiding the use of the stencil and of the screening steps. Screening process is a labourious operation which requires very sophisticated equipment and a very high precision in the design of the stencil. Because of these requirements, screening is an expensive process. On the other hand offset printing is a very simple, cheap and reliable method. In addition, the film forming properties allow the material to create a protective film even with a thin deposited film.
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Abate Joseph P.
Edmondson Lynne R.
LandOfFree
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