Water soluble fluxes and methods of using the same

Metal fusion bonding – Process – With protecting of work or filler or applying flux

Reexamination Certificate

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Details

C228S207000, C148S023000

Reexamination Certificate

active

06752309

ABSTRACT:

TECHNICAL FIELD OF THE INVENTION
This invention relates to water soluble fluxes and methods of making the same. The water soluble fluxes comprise, at least one wax carrier and at least one surfactant, and at least one activator.
BACKGROUND OF THE INVENTION
Fluxes are used to promote the wetting of the metal surface with molten solder. Previously, rosin based fluxes were used. These materials left residue which was removed only with the use of organic solvents. The organic solvents would evaporate and adversely affect people and the environment.
Water soluble fluxes provide the improved “fluxing” and additionally the residue of the flux can be removed by water. Water soluble fluxes provide removal of flux residue without the exposure of people and the environment to harmful volatile organic chemicals. However, water soluble fluxes have suffered from a number of drawbacks. The water soluble fluxes often give off smoke on heating, turn liquid above 100° F., are difficult to apply with a brush, fail to provide excellent pull through of the solder in the joint, promote seizing of the joint, turn copper green and/or burst into flame upon heating with a torch. It is desirable to have a water soluble flux whose residue is removable with water and which does not have the above limitations.
SUMMARY OF THE INVENTION
The present invention relates to water soluble fluxes which comprise at least one wax carrier, at least one surfactant and at least one activator. The present water soluble fluxes are easily applicable with a brush. They have excellent pull through of solder in the joint. The water soluble flux avoids turning copper green and does not burst into flame on heating with a torch.


REFERENCES:
patent: 3925112 (1975-12-01), Petersen, Sr. et al.
patent: 3977916 (1976-08-01), Stayner et al.
patent: 4216035 (1980-08-01), Bakos et al.
patent: 4269870 (1981-05-01), Boynton
patent: 4290824 (1981-09-01), Cole
patent: 4460414 (1984-07-01), Hwang
patent: 4478650 (1984-10-01), Zado
patent: 4657589 (1987-04-01), Barajas
patent: 4701224 (1987-10-01), Zado
patent: 4708751 (1987-11-01), Froebel et al.
patent: 4818387 (1989-04-01), Ikeda et al.
patent: 4895606 (1990-01-01), Jafri
patent: 4988395 (1991-01-01), Taguchi et al.
patent: 4994119 (1991-02-01), Gutierrez et al.
patent: 5011546 (1991-04-01), Frazier et al.
patent: 5069730 (1991-12-01), Dodd et al.
patent: 5085365 (1992-02-01), Turner
patent: 5141568 (1992-08-01), Turner et al.
patent: 5145532 (1992-09-01), Fukunaga et al.
patent: 5150832 (1992-09-01), Degani et al.
patent: 5196070 (1993-03-01), Ables et al.
patent: 5198038 (1993-03-01), Turner et al.
patent: 5215602 (1993-06-01), Ali et al.
patent: 5234508 (1993-08-01), Kobayashi et al.
patent: 5354623 (1994-10-01), Hall
patent: 5443659 (1995-08-01), Nonogaki et al.
patent: 5601228 (1997-02-01), Fukunaga et al.
patent: 384 627 (1990-02-01), None
patent: 483 762 (1991-10-01), None
F.R. Moser et al;Water-Soluble Flux for Pb/ln Solder Joints and Stacked Joints;IBM Technical Disclosure Bulletin, vol. 21, No. 3 Aug. 1978.
W.R. Lewis;Some Further Flux Trials With Polyethylene Glycol; TIN AND ITS USES, No. 48, Autumn 1959.
W.R. Lewis;A New Medium For Resin Flux Polyethylene Glycol; No. 46, Spring 1959.
Dennis F. Bernier;The Nature of White Residue on Printed Circuit Assemblies;Nature of white residue, pp. 1-6, Apr. 1988.
F.M. Zado;Effects of Non-Ionic Water Soluble Flux Residues;Proceedings of the NEPCON Conference, 1979.
D. Rocak et al;Replacement of CFS Solvents by New“No Clean ”Fluxes or New Solvents for Electronic Circuit Cleaning After Soldering;Informacije MIDEM 25 (1995)3, str.. 209-213.
P. Amoukhteh;Qualification of Water Soluble Fluxes for Solder Paste Application;pp. 2103-2110.
C.J. Owen et al;Water-Soluble Flux;IBM Technical Disclosure Bulletin, vol. 20, No. 2, Jul. 1977.
M. Nasta et al;A model of the Solder Flux Reaction: Reactions at the Metal/MetalOxide/Electrolyte Solution Interface;Circuit World, vol. 21, No. 4, 1995.
T. Van der Molen;Water Soluable Fluxes vs. Rosin Fluxes for Soft Soldering of Electronic Devices;Insulation Circuits, pp. 32-38, May 1977.
P. Schuessier;Water-Soluble Flux Technology;Insulation Circuits, pp. 88-91, Dec 1981.
D.A. Dietz;Aqueous and Water-Soluble;Circiuts Assembly, pp. 62-64, Jun 1993.
EP 99 30 5865; European Search Report mailed Sep. 3, 2003.
“Carbowax” Polythylene Glycols as Vehicles for Soldering Fluxes.
W.R. Lewis;Waterless Soldering Fluxes Using Polyethylene Glycol;TIN ANT ITS USES, No. 51, 1961.
W.R. Lewis;Polyethylene Glycol as a Vehicle for Acid Fluxes;TIN AND ITS USES, No. 47, Summer 1959.

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