Water soluble adhesive coating for mounting components to printe

Details Water soluble adhesive coating for mounting components to printe Water soluble adhesive coating for mounting components to printe

1977-12-27

1980-07-29

Ziegler, J.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

29729, 260 294R, 260 296R, 260 296HN, 260 296ME, C08L 2326, C08L 6126, C08L 7904

Patent

active

042150256

ABSTRACT:
Components can be held down on printed circuit boards by applying compositions comprising a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give a greater than 45% solids content with a viscosity range of about 8 to about 12 poises at about 25.degree. C., a water soluble mono- or polyhydric alcohol, water, a wetting agent, and a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group, to the printed circuit board prior to insertion of the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.

REFERENCES:
patent: 3067159 (1962-12-01), Musser
patent: 3256247 (1966-06-01), Gagliardi et al.
patent: 3296208 (1967-01-01), Rogers
patent: 3649597 (1972-03-01), Henley, Jr.

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