Water removable solder stop

Details Water removable solder stop Water removable solder stop

1988-12-16

1990-05-29

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 26, B23K 3534

Patent

active

049292846

ABSTRACT:
A solder stop composition and a method of preventing a melt condition in a meltable metal alloy on a substrate, such as a circuit board, wherein the composition applied on the alloy contains a water soluble binder, a viscosity control agent, a thermal insulator filler, a water soluble moisturizer extender control agent and water. The dried composition is non-tacky and can be removed from the substrate with water. A typical composition capable of being cured to a dry state on a substrate contains water, glycerin, amorphous silica, glass microballoons filled with inert gas and ethylene glycol.

REFERENCES:
patent: 3149007 (1964-09-01), Chamer
patent: 3309239 (1967-03-01), Harris
patent: 3599326 (1971-08-01), DiRenzo
patent: 3703386 (1972-11-01), Dietz
patent: 3906617 (1975-09-01), Behringer et al.
patent: 3981753 (1976-09-01), Hopper
patent: 4113524 (1978-09-01), Katz
patent: 4120843 (1978-10-01), Ameen et al.
patent: 4439250 (1984-03-01), Acharya et al.

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