Water-permeable adhesive tape

Details Water-permeable adhesive tape Water-permeable adhesive tape

2007-01-08

2009-10-27

Singh-Pandey, Arti (Department: 1794)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S308400, C428S317500

Reexamination Certificate

active

07608328

ABSTRACT:
The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

REFERENCES:
patent: 4702788 (1987-10-01), Okui
patent: 5229185 (1993-07-01), Shiota et al.
patent: 6114753 (2000-09-01), Nagai et al.
patent: 0 157 508 (1985-10-01), None
patent: 63 136527 (1988-06-01), None
patent: 2-112258 (1990-04-01), None
patent: 6-21220 (1994-01-01), None
patent: 9-272850 (1997-10-01), None
patent: 09-321084 (1997-12-01), None
patent: 10-072573 (1998-03-01), None
patent: 11-151661 (1999-06-01), None
patent: WO 95/32834 (1995-12-01), None
European Search Report dated Sep. 29, 2000.

Affiliated with

Also associated with

Rating

Water-permeable adhesive tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Water-permeable adhesive tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Water-permeable adhesive tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4060342