Water jet processing method

Details Water jet processing method Water jet processing method

2006-01-03

2006-01-03

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S462000, C438S464000

Reexamination Certificate

active

06982211

ABSTRACT:
A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

REFERENCES:
patent: 6676485 (2004-01-01), Quirke et al.
patent: 2005/0126472 (2005-06-01), Popescu et al.
patent: 2005/0145166 (2005-07-01), Seo et al.
patent: 2005/0158967 (2005-07-01), Huang et al.

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