Water-cooling heat dissipation device adopted for modulized...

Details Water-cooling heat dissipation device adopted for modulized... Water-cooling heat dissipation device adopted for modulized...

2006-11-28

2006-11-28

Quach-Lee, Y. My (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C362S218000

Reexamination Certificate

active

07140753

ABSTRACT:
A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

REFERENCES:
patent: 3372740 (1968-03-01), Kastovich et al.
patent: 5791770 (1998-08-01), Hoyt et al.
patent: 6388317 (2002-05-01), Reese
patent: 6661658 (2003-12-01), Capriz et al.
patent: 2005/0047140 (2005-03-01), Chang

Affiliated with

Also associated with

Rating

Water-cooling heat dissipation device adopted for modulized... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Water-cooling heat dissipation device adopted for modulized..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Water-cooling heat dissipation device adopted for modulized... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3692056