Water-borne, water redispersible, laminating adhesives for nonwo

Details Water-borne, water redispersible, laminating adhesives for nonwo Water-borne, water redispersible, laminating adhesives for nonwo

1994-08-12

1996-07-02

Davis, Jenna

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

428355, 524 48, 524 50, 524 51, 524 52, 524457, 524734, 524804, 524820, 524824, 524833, 524834, 524835, 524836, 524292, 524315, C09J 1106, C09J10302

Patent

active

055323006

ABSTRACT:
A specific class of water-borne, water redispersible laminating adhesives is disclosed which is desirable for bonding nonwoven substrates to themselves or to other substrates. The adhesives provide improved bond strength and improved water redispersibility when compared to laminating adhesives currently used for the same purpose. Furthermore, the novel adhesives are much less sensitive to the presence of significant levels of plasticizer than are laminating adhesives currently used, which exhibit reduced water redispersibility when such plasticizers are present in significant amounts. The novel laminating adhesives contain an aqueous styrene/acrylic polymer dispersion prepared by radical-initiated emulsion polymerization of unsaturated monomers in the presence of starch degradation products having a weight average molecular weight range of from about 2500 to 25000 and which are obtainable by hydrolysis in the aqueous phase. The adhesives may contain only the starch-modified, styrene/acrylic polymer dispersion, or may further include other components, such as plasticizers and/or rheology modifiers, when required. The novel adhesives are particularly useful in disposable articles wherein a nonwoven substrate is bonded to a second substrate via a water-borne, laminating adhesive. The disposable articles may include an absorbent core portion disposed between and proximate the nonwoven and second substrate.

REFERENCES:
patent: 5217798 (1993-06-01), Brady et al.

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