Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2001-09-13
2004-05-11
Yoon, Tae H. (Department: 1714)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S210000, C523S501000, C523S205000, C524S276000, C524S845000, C528S274000
Reexamination Certificate
active
06734228
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a thermosetting water-based resin composition, a process for preparing the same, and a molding compound composition comprising the water-based resin composition and a molding product prepared by molding the molding compound composition.
BACKGROUND ART
As molding products used in automobile interior materials and construction materials, there have been used various molding products prepared by molding a substrate made of fibers or wood materials with an adhesive such as phenolic resins, urea resins, and melamine resins (Japanese Patent Laid-Open No. Hei 7-1666). In this process, however, there arises a problem of generating formalin from the molding products. In addition, the molding processing is carried out by using a mixture prepared by dissolving an unsaturated polyester resin and an organic peroxide in a polymerizable monomer such as styrene (Japanese Patent Laid-Open No. Hei 10-36653), or by using a mixture prepared by simply mixing an unsaturated polyester resin and an organic peroxide (Japanese Patent Laid-Open No. Sho 52-63286). In these processes, however, there arise such problems that the monomers have odors and that homogeneous curing reaction is less likely to take place.
An object of the present invention is to provide a molding compound composition in which an environmental problem is improved and a homogeneous curing reaction takes place, and a molding product prepared by molding the molding compound composition.
Another object of the present invention is to provide a water-based resin composition suitable for obtaining the molding compound composition, and a process for preparing the same.
These and other objects of the present invention will be apparent from the following description.
DISCLOSURE OF INVENTION
The present invention pertains to:
[1] a thermosetting water-based resin composition (hereinafter referred to as “water-based resin composition”) comprising an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270° C. and a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g, and wherein said oil-soluble initiator is present in said polycondensation resin;
[2] the water-based resin composition according to item [1] above, further comprising a compound having two or more radical-polymerizable unsaturated bonds;
[3] the water-based resin composition according to item [1] or [2] above, further comprising an acetylene glycol compound represented by the formula (I):
wherein each of R
1
to R
4
is independently a linear alkyl group having 1 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms; and each of m and n is an integer of 0 or more;
[4] the water-based resin composition according to any one of items [1] to [3] above, further comprising a wax;
[5] a process for preparing a thermosetting water-based resin composition, the process comprising removing an organic solvent by distillation from a raw material composition comprising a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g; an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270° C.; the organic solvent; a neutralizing agent; and water, to give the thermosetting water-based resin composition comprising the polycondensation resin and the oil-soluble initiator, wherein said oil-soluble initiator is present in said polycondensation resin;
[6] the process according to item [5] above, wherein the raw material composition further comprises a compound having two or more radical-polymerizable unsaturated bonds;
[7] the process according to item [5] or [6], wherein the raw material composition further comprises an acetylene glycol compound represented by the formula (I);
[8] a molding compound composition comprising the water-based resin composition of any one of items [1] to [4] above; and
[9] a molding product prepared by molding the molding compound composition of item [8] above.
BEST MODE FOR CARRYING OUT THE INVENTION
One of the large feature of the water-based resin composition of the present invention resides in that an oil-soluble initiator of which a temperature for one-minute half-life of from 90° to 270° C. is contained in a polycondensation resin particle. When the water-based resin composition comprising the oil-soluble initiator is used for a molding compound composition, the water-based resin composition is adhered evenly on a molding substrate, and when such a molding compound composition is molded (heat-pressed), the oil-soluble initiator is decomposed in the fine particles of the polycondensation resin. Therefore, the homogeneous thermosetting reaction efficiently takes place in an entire molding compound composition, so that there can be exhibited an excellent effect that a molding product having a homogeneous strength is obtained. Incidentally, the water-based resin composition of the present invention does not use at all any material which generates formaldehyde, and the like, and it is also water-based, so that there arise no environmental problems. In addition, in the present specification, the term “oil-soluble initiator” refers to an initiator which is dissolved in an organic solvent usable in the preparation process at room temperature (20° C.) in an amount of 1% by weight or more. In addition, the term “temperature for one-minute half-life” refers to a temperature at which the amount of active oxygen in benzene is halved in one minute.
The oil-soluble initiator is not particularly limited, as long as the half-life temperature in one minute is from 90° to 270° C., preferably from 90° to 200° C. The oil-soluble initiator includes organic peroxides, azo polymerization initiators, and the like. Among them, the organic peroxides are preferable from the viewpoint of having high reactivity.
The organic peroxides include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxydicarbonates, peroxyesters, and the like, and those having large amount of active oxygen and small activation energy are preferable. Preferable concrete examples include lauroyl peroxide [temperature for one-minute half-life (referred to the same hereinafter, and omitted): 116.4° C.], 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane [147.1° C.], 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane [149.0° C.], t-butylperoxylaurate [159.4° C.], t-butylperoxyisopropylmonocarbonate [158.8° C.], t-butylperoxy-2-ethylhexylcarbonate [161.4° C.], di-t-butylperoxyhexahydroterephthalate [142.0° C.], dicumyl peroxide [175.2° C.], 2,5-dimethyl-2,5-di(t-butylperoxy)hexane [179.8° C.], di-t-butyl peroxide [185.9° C.], t-butylperoxy-2-ethylhexanoate [134.0° C.], bis(4-t-butylcyclohexyl)peroxydicarbonate [92.1° C.], t-amylperoxy-3,5,5-trimethylhexanoate [130.0° C.], 1,1-di(t-amylperoxy)-3,3,5-trimethylcyclohexane [151.0° C.], and the like.
The azo polymerization initiator includes 2,2′-azobis-isobutyronitrile [temperature for one-minute half-life (referred to the same hereinafter, and omitted): 116.0° C.], 2,2′-azobis-2-methylbutyronitrile [119.0° C.], 2,2′-azobis-2,4-dimethylvaleronitrile [104.0° C.], 1,1′-azobis-1-cyclohexanecarbonitrile [141.0° C.], dimethyl-2,2′-azobisisobutyrate [119.0° C.], 1,1′-azobis-(1-acetoxy-1-phenylet
Kawabe Kuniyasu
Sakuma Tadashi
Birch & Stewart Kolasch & Birch, LLP
Kao Corporation
Yoon Tae H.
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