Water-based polish

Abrasive tool making process – material – or composition – With synthetic resin

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Details

51293, 51303, 51304, 51309, 106 8, C09K 314

Patent

active

052660885

ABSTRACT:
This invention relates to a composition comprising: water; particulate abrasive dispersed in said water, said abrasive having a Knoop scale hardness of at least about 1000 and an average particle size of from about 1 micron up to a U.S. Sieve Series Number of about 50; and an effective amount of at least one thickener to maintain a stable dispersion of said abrasive in said water. The inventive composition can contain one or more surfactants and/or one or more chelating agents. In one embodiment the invention provides for a water-based polish that can be used on any nonporous surface (e.g., glass, plastic, metal, painted surfaces, waxed surfaces, marble, ceramic, soft-precious and semi-precious stones, semi-conductor materials, metallurgical and geological specimens, Formica, etc.). In a particularly advantageous embodiment the electrical conductivity of the inventive water-based polish is sufficiently reduced to the point where it can be applied using an electrically powered applicator without risk of injury to the user due to electrical shock.

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patent: 4218250 (1980-08-01), Kasprzak
patent: 4242842 (1981-01-01), Yancey
patent: 4581042 (1986-04-01), Willmore
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patent: 4935039 (1990-06-01), Miyazaki et al.
patent: 4952240 (1990-08-01), Smith
patent: 5017222 (1991-05-01), Cifuentes et al.
patent: 5154759 (1992-10-01), Cifuentes et al.

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