Water-based adhesive curing process and associated apparatus

Details Water-based adhesive curing process and associated apparatus Water-based adhesive curing process and associated apparatus

2011-06-21

2011-06-21

Nguyen, Khanh (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S320000, C156S210000, C156S499000, C156S356000, C156S217000, C156S224000, C156S227000, C156S358000

Reexamination Certificate

active

07964056

ABSTRACT:
A process and implementing apparatus are disclosed by which the curing time of a water-based adhesive is shortened as applied to the bonding of two fibrous substrates, such as paperboard or corrugated fiberboard.

REFERENCES:
patent: 1851709 (1932-03-01), Laucks et al.
patent: 3920496 (1975-11-01), Wilkinson et al.
patent: 4375383 (1983-03-01), Sewell et al.
patent: 4490129 (1984-12-01), Oakley
patent: 4778554 (1988-10-01), Doman
patent: 5567257 (1996-10-01), Higgins et al.
patent: 5916409 (1999-06-01), Mosburger
patent: 6083580 (2000-07-01), Finestone et al.
patent: 6939421 (2005-09-01), Bremont et al.
patent: 7238149 (2007-07-01), Lorenz et al.
patent: 2004/0164135 (2004-08-01), Gong et al.
patent: 2004/0166238 (2004-08-01), Nowicki et al.

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