Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1998-02-13
1999-10-05
Michl, Paul R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C08L 6104
Patent
active
059625767
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a water-based adhesive. The present invention also relates to the use of a water-based adhesive as primer on a substrate.
BACKGROUND OF THE INVENTION
From the U.S. Pat. No. 5,200,455 the aqueous composition of an adhesive is known, which is used as primer and contains an aqueous phenolic resin dispersion stabilized by polyvinyl alcohol, a latex of a chlorosulfonated polyethylene and a metal oxide. With this adhesive there is achieved a good adhesion (adhesive force) of a layer applied onto a substrate.
OBJECT OF THE INVENTION
It is the object of the present invention to provide a further adhesive which is free from organic solvents and can be used as adhesion promoter (primer).
SUMMARY OF THE INVENTION
The object underlying the present invention is acheived by a water-based adhesive containing an aqueous dispersion of one or several phenolic resins, which has been stabilized by one or several polyacrylates, one or several latices of one or several halogenated polyolefins and one or several cross-linking agents. The halogenated polyolefin is a water-dilutable or emulsifiable as well as dispersible, polymeric film-forming agent. To the inventive adhesive, pigments and/or soot may be added. As pigments in accordance with the invention TiO.sub.2 and/or SiO.sub.2 are preferably used. The inventive adhesive is free from organic solvents. It merely has a content of <5 wt-% of low-molecular, hydroxyl-containing organic compounds.
Surprisingly, the omission of organic solvents in the inventive agent does not lead to a deterioration of the adhesive force, not even in the case of iron-containing substrates, which would have to be expected in the form of a beginning formation of rust. With the inventive adhesive excellent corrosion resistances are surprisingly achieved. Substrates to be coated preferably include iron-containing metals, but also aluminium or plastics such as polyamide. When using the inventive agent no organic solvents are released. The agent can be handled very easily, as it does not affect the environment. Waste air cleaning and special fire protection measures are not necessary when employing the inventive agent. Due to the use of the inventive agent the coating process is environmentally acceptable and economic.
A preferred embodiment of the invention is an adhesive which on 100 parts of one or several halogenated polyolefins contains 0.1 to 80 parts of one or several polyacrylates, 50 to 500 parts of one or several phenolic resins and 1 to 100 parts of one or several cross-linking agents. In accordance with the invention, parts are meant to be parts by weight. With this composition a particularly high adhesive force of the adhesive is achieved. To the agent, 30 to 300 parts pigment and/or soot may in addition be added. The dry matter content of the aqueous suspension should be 17 to 65 wt-%.
A preferred embodiment of the invention is a water-based adhesive, where the aqueous dispersion of one or several phenolic resins, which has been stabilized by one or several polyacrylates, is obtained by mixing
This dispersion is thus advantageously prepared without the use of an organic solvent. It can be prepared within a surprisingly short period and with very little effort.
A preferred embodiment of the invention is a water-based adhesive, where the phenolic resin is a condensation product of phenols with formaldehyde. With this heat-reactive phenolic resin good results are achieved with respect to the adhesiveness with a small content of low-molecular, hydroxyl-containing, organic compounds.
A particularly preferred embodiment of the invention is a water-based adhesive, where the phenolic resin is a resol and/or novolak resin. With this heat-reactive phenolic resin very good results are achieved with respect to the adhesiveness with a very small content of low-molecular, hydroxyl-containing, organic compounds.
A most preferred embodiment of the invention is a water-based adhesive, where at least one phenolic resin is hydrophobic. With t
REFERENCES:
patent: 5728767 (1998-03-01), Kanetou
Dehnicke Stefan
List Ernst
Rullmann Helmut
Zellner Adolf
Dubno Herbert
Metallgesellschaft Aktiengesellschaft
Michl Paul R.
Myers Jonathan
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