Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2000-09-19
2002-02-05
Doerrler, William (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C062S003700, C062S003200
Reexamination Certificate
active
06343478
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a CPU cooling arrangement, and more specifically to a water/air dual cooling method CPU cooling arrangement.
During the operation of a computer, heat must be quickly carried away from the CPU, keeping the temperature of the CPU within the designed working range. According to tests or the so-called “10 degree rule”, the service life of the CPU will be shortened by half if the temperature of the CPU is increased by 10° C. Various CPU cooling methods and devices have been disclosed.
FIG. 1
shows an air-cooling type CPU cooling arrangement according to the prior art. According to this design, a heat sink
12
is closely attached to the CPU
14
and adapted to receive heat from the CPU
14
, and a fan
10
is mounted on the heat sink
12
and adapted to cause currents of air toward the heat sink, enabling heat to be quickly dissipated from the heat sink
12
into the air. This arrangement is functional, however it becomes workless if the fan is damaged, or stuck by dust or external objects.
FIG. 2
illustrates another design of CPU cooling arrangement according to the prior art. This design uses cooling water to carry heat away from the CPU. According to this design, a metal water accumulator
21
is closely attached to the CPU
14
to be cooled down. The metal water accumulator
21
has a water input end connected to a water input tube
22
, and a water output end connected to a water output tube
23
. The water input tube
22
and the water output tube
23
are respectively connected to output and input ends of water pumping and heat exchanging unit. This design is functional. However, this design becomes workless if pump means of the water pumping and heat-exchanging unit fails, or the piping is blocked.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a water/air dual cooling method CPU cooling arrangement, which eliminates the aforesaid problems. It is one object of the present invention to provide a water/air dual cooling method CPU cooling arrangement, which uses an air-cooling system and a water cooling system to effectively and quickly carry heat away from the CPU. It is another object of the present invention to provide a water/air dual cooling method CPU cooling arrangement, which keeps functioning well in case the water-cooling system fails. It is still another object of the present invention to provide a water/air dual cooling method CPU cooling arrangement, which keeps functioning well in case the air-cooling system fails. It is still another object of the present invention to provide a water/air dual cooling method CPU cooling arrangement, which is compact, and requires less installation space.
REFERENCES:
patent: 4328682 (1982-05-01), Vana
patent: 5230223 (1993-07-01), Hullar et al.
patent: 5269146 (1993-12-01), Kerner
patent: 5291941 (1994-03-01), Enomoto et al.
patent: 5471850 (1995-12-01), Cowans
patent: 5823005 (1998-10-01), Alexander et al.
patent: 6166907 (2000-12-01), Chien
patent: 6196003 (2001-03-01), Macias et al.
patent: 6205803 (2001-03-01), Scaringe
patent: 6213194 (2001-04-01), Chrysler et al.
Doerrler William
Rosenberg , Klein & Lee
Shulman Mark S.
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