Water-absorbing agent for organic EL device and organic EL...

Stock material or miscellaneous articles – Composite – Of inorganic material

Reexamination Certificate

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C428S076000, C428S917000, C252S194000, C313S504000, C313S506000, C313S512000, C257S100000

Reexamination Certificate

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07622199

ABSTRACT:
A thin-profile organic EL device with a high degree of reliability is provided. The anode, the organic layer and the light transmissible-type cathode are laminated on the substrate and the inorganic water-barrier layer are laminated thereon, and then a UV rays-curable type water-capturing agent comprising a UV rays-curing agent and a water-absorbing agent is cured to bond to the sealing substrate instead of an adhesive layer. The UV rays-curing agent comprises an acrylic monomer, initiator and accelerator. The UV rays-curable type sealing agent is placed to the outer peripheral portion of the UV rays-curable type water-capturing agent to be cured. The emission of the organic layer is transmitted upward via the cathode, UV rays-curable type water-capturing agent and the sealing substrate. The UV rays-curable type water-capturing agent can be formed in a desired thickness and pattern by applying it and irradiating with UV-rays, thereby making it possible to produce a low-profile organic EL device in large quantities with a high degree of reliability and without damaging the organic layer which is not resistant to water.

REFERENCES:
patent: 6226890 (2001-05-01), Boroson et al.
patent: 6878467 (2005-04-01), Chung et al.
patent: 6987354 (2006-01-01), Arakawa et al.
patent: 2002/0015818 (2002-02-01), Takahashi et al.
patent: 2003/0170496 (2003-09-01), Hieda et al.
patent: 2004/0061439 (2004-04-01), Cok
patent: 2002231443 (2002-08-01), None
Abstract of Pat. No. JP2002231443 dated Aug. 16, 2002.
Patent Abstract of Japan 2002-033187, published Jan. 31, 2002.
Patent Abstract of Japan 2002-083688, published Mar. 22, 2002.
Patent Abstract of Japan 2003-347043, published Dec. 5, 2003.
Patent Abstract of Japan 2004-079209, published Mar. 11, 2004.
Patent Abstract of Japan 2004-103514, published Apr. 2, 2004.

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