Wasteless type lamination system

Details Wasteless type lamination system Wasteless type lamination system

2006-06-27

2006-06-27

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

C156S378000, C156S543000, C156S555000

Reexamination Certificate

active

07066231

ABSTRACT:
A wasteless type lamination system comprises a first transfer device for transferring along a first transfer path a continuous laminate film; a cutter for cutting the continuous laminate film in a predetermined length, provided beside the first transfer path at the downstream of the first transfer device; a second transfer device for transferring along the first transfer path a cut laminate film; a film detection sensor for detecting a leading edge of the continuous laminate film, provided beside the first transfer path at the downstream of the cutter; a card transfer device for transferring a card along a second transfer path; and a thermocompression bonding device for laminating the cut laminate film to the card. The continuous laminate film is moved backward from the cutter by a predetermined distance by the first transfer device before or after cutting action of the cutter.

REFERENCES:
patent: 4570870 (1986-02-01), Ito
patent: 5552986 (1996-09-01), Omura et al.
patent: 5783024 (1998-07-01), Forkert
patent: 5987284 (1999-11-01), Lewis
patent: 6315020 (2001-11-01), Seki
patent: 6367379 (2002-04-01), Toda
patent: 6736179 (2004-05-01), Ito et al.
patent: 11048551 (1999-02-01), None

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