Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1994-08-16
1996-12-17
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
1566361, 1566421, H01L 2100
Patent
active
055849598
ABSTRACT:
A waste treatment system in a polishing apparatus treats waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by a polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.
REFERENCES:
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patent: 4372805 (1983-02-01), Takahashi et al.
patent: 5032203 (1991-07-01), Doy et al.
patent: 5118286 (1992-06-01), Sarin
patent: 5211843 (1993-05-01), Wester et al.
Patent Abstracts of Japan, vol. 15, No. 143 (E-1054), Apr. 11, 1991.
Patent Abstracts of Japan, vol. 16, No. 110 (C-920) [5153], Mar. 18, 1992.
Aoki Katsuyuki
Ishikawa Seiji
Kawashima Kiyotaka
Kimura Norio
Dang Thi
Ebara Corporation
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