Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-07-16
1995-09-26
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 361689, 361699, 361700, 16510421, 16510426, 16510433, H01L 2504, H01L 2302
Patent
active
054536413
ABSTRACT:
A cooling device formed in a thermally conductive substrate having at least one microchannel of dimensions that induce capillary action and a surface in thermal contact with a heated region. The microchannel has a longitudinal opening oriented away from the heated region and is supplied with liquid coolant which is contained by a meniscus near the opening. The coolant vaporizes at the meniscus and absorbs heat but, due to increased pressure in the coolant contained by the meniscus, does not boil within the microchannel, allowing more liquid coolant contact with the thermally conductive substrate and walls. The vaporized coolant is discharged into a chamber facing the opening which can be at a lower pressure to remove additional heat by gaseous expansion. The discharge of gaseous coolant allows the capillary flow of the liquid coolant in the microchannels to be unimpeded, and may be augmented by a fluid pump. The gaseous coolant may be in thermal contact with a condenser that liquefies the coolant for supply to the microchannels, by an array of capillaries, in a self contained cooling device. An array of such devices is provided with holes and stacked to connect adjacent liquid and gaseous coolant flows to cool an array of heated objects, such as laser diode bars.
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Mundinger David C.
Scifres Donald R.
Arroyo T. M.
Hille Rolf
SDL Inc.
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