Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2007-02-13
2007-02-13
Webb, Gregory E. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C134S001300
Reexamination Certificate
active
10659190
ABSTRACT:
An object of the present invention is to provide washing liquid for semiconductor substrate capable of removing grinding grains of silica, alumina or the like in a polishing agent and polishing trashes of copper, and capable of leaving little organic substance due to an additive used for preventing corrosion of copper on the surface of a copper wiring after washing, while corrosion of copper is suppressed, and a method of producing a semiconductor device using this washing liquid. The object is achieved by washing liquid for a semiconductor substrate having a copper wiring, comprising a basic compound and at least one selected from the group consisting of sugar alcohols and saccharides. Also the present invention provides a method of producing a semiconductor device comprising a step of forming a copper wiring by chemical mechanical polishing and washing it with washing liquid for a semiconductor substrate containing a basic compound and at least one selected from the group consisting of sugar alcohols and saccharides.
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Akin Gump Strauss Hauer & Feld & LLP
Dongwoo Fine-Chem Co., Ltd.
Webb Gregory E.
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