Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-11-21
2006-11-21
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C134S001300
Reexamination Certificate
active
07138362
ABSTRACT:
There is provided a washing liquid composition for a semiconductor substrate having a contact angle between the surface thereof and water dropped thereon of at least 70 degrees, the washing liquid composition including an aliphatic polycarboxylic acid and a surfactant, and the washing liquid composition having a contact angle of at most 50 degrees when dropped on the semiconductor substrate. It is thereby possible to effectively remove particles and metals on the surface of a hydrophobic substrate without corroding it.
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Abe Yumiko
Aoki Hidemitsu
Ishikawa Norio
Kasama Yoshiko
Tomimori Hiroaki
Kanto Kagaku Kabushiki Kaisha
Licata & Tyrrell P.C.
NEC Electronics Corporation
Webb Gregory
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