Warpage-proof circuit board structure

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S260000, C174S261000, C174S262000, C174S263000, C257S673000, C257S700000, C257S723000, C257S778000, C438S106000, C438S612000, C361S790000, C361S795000, C361S803000

Reexamination Certificate

active

07875805

ABSTRACT:
The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure.

REFERENCES:
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 6036836 (2000-03-01), Peeters et al.
patent: 6461953 (2002-10-01), Sakuyama et al.
patent: 6479887 (2002-11-01), Yoon et al.
patent: 6525275 (2003-02-01), Asai
patent: 6582581 (2003-06-01), Goldberg et al.
patent: 6759596 (2004-07-01), Shelnut et al.
patent: 6944945 (2005-09-01), Shipley et al.
patent: 7114251 (2006-10-01), Mashino
patent: 7122907 (2006-10-01), Lee
patent: 7352054 (2008-04-01), Jobetto
patent: 7452797 (2008-11-01), Kukimoto et al.
patent: 7517788 (2009-04-01), Pang et al.
patent: 7745736 (2010-06-01), Ogawa et al.
patent: 2004/0046252 (2004-03-01), Fujimori et al.
patent: 2004/0142226 (2004-07-01), Yamauchi et al.
patent: 2005/0170631 (2005-08-01), Yuri
patent: 2006/0131730 (2006-06-01), Nakamura
patent: 2007/0018308 (2007-01-01), Schott et al.
patent: 2007/0045867 (2007-03-01), Machida

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Warpage-proof circuit board structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Warpage-proof circuit board structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Warpage-proof circuit board structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2645257

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.