Warpage-preventive circuit board and method for fabricating...

Details Warpage-preventive circuit board and method for fabricating... Warpage-preventive circuit board and method for fabricating...

2005-03-08

2005-03-08

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

06864434

ABSTRACT:
A warpage-preventive circuit board and method for fabricating the same is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface of the electrically-insulative core layer at area free of the conductive traces, with adjacent dummy circuit regions being spaced apart by at least a chink. During a high-temperature fabrication process, the dummy circuit regions help reduce thermal stress and the chinks absorb thermal expansion of the dummy circuit regions, to thereby prevent warpage of the circuit board and cracks of a chip mounted on the circuit board, such that yield and reliability of fabricated semiconductor devices can be improved.

REFERENCES:
patent: 6204559 (2001-03-01), Lin et al.
patent: 6323438 (2001-11-01), Ito
patent: 6380633 (2002-04-01), Tsai
patent: 6476331 (2002-11-01), Kim et al.
patent: 6507100 (2003-01-01), Valluri et al.
patent: 40851258 (1996-02-01), None
patent: 02001326429 (2001-11-01), None

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