Warpage control of array packaging

Details Warpage control of array packaging Warpage control of array packaging

2007-02-06

2007-02-06

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21502

Reexamination Certificate

active

10740303

ABSTRACT:
During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-induced warpage of package strips during PEC. In one embodiment, the angled lands and angled side-insertions clamps are used to clamp the edges of the package strip in order to introduce an intentional deformation which counters warpage which occurs during PEC. The angled lands and side-insertion clamps may be at any angle (fixed or adjustable). The side-insertion clamps may be inserted before or after insertion of the package strips into the carrier. Once the package strips are in the carrier and resting on the angled lands, a force may be applied to the side-insertion clamps to clamp the edges of the package strips between a clamp fin and an angled land.

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