Warp-resistent ultra-thin integrated circuit package fabrication

Details Warp-resistent ultra-thin integrated circuit package fabrication Warp-resistent ultra-thin integrated circuit package fabrication

1994-03-04

1994-11-29

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437217, 437219, H01L 2160

Patent

active

053690583

ABSTRACT:
The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface and after a layer of adhesive has been applied to the thin layer of material and cured. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.

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