Warm hydro-forming device

Details Warm hydro-forming device Warm hydro-forming device

2007-06-19

2007-06-19

Jones, David B. (Department: 3725)

Metal deforming

By application of fluent medium, or energy field

Using fixed die

C072S062000, C072S342960, C029S421100

Reexamination Certificate

active

11040521

ABSTRACT:
A warm hydro-forming device comprises: an upper mold and a lower mold respectively mounted to an upper mold die and a lower mold die; a lifting die installed to the lower mold die through a guide unit, an upper portion of the lifting die being connected to the upper mold die through a lifting unit to cooperatively operate in an upward and downward direction with the upper mold die; a pair of hydraulic pressure cylinders for providing an axial compression force to the tube component and supplying a forming hydraulic fluid into the tube component; an ascending and descending unit for ascending or descending the upper mold die; and a heating unit associated with the lifting die such that the heating unit can move toward or away from the tube component. The heating unit heats the tube component and a forming hydraulic fluid through a high frequency induction heating.

REFERENCES:
patent: 4437326 (1984-03-01), Carlson
patent: 5233854 (1993-08-01), Bowman et al.
patent: 5475911 (1995-12-01), Wells et al.
patent: 5960658 (1999-10-01), Hudson et al.
patent: 5992197 (1999-11-01), Freeman et al.
patent: 6322645 (2001-11-01), Dykstra et al.
patent: 6349538 (2002-02-01), Hunter et al.
patent: 6613164 (2003-09-01), Dykstra et al.
patent: 2004/0065394 (2004-04-01), Ryu et al.
patent: 10108419 (2002-09-01), None
patent: 10162439 (2003-07-01), None

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