Wallboard bundling tape and method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156216, 428 43, 428122, 428194, 206451, 2291232, B32B 3100

Patent

active

050873105

ABSTRACT:
A bundling tape has two rows of perforations extending from one end of the tape to the other; the perforations are arranged inward of and substantially parallel to the edges. A first band is formed between one edge and a first row of perforations, and a second band is formed between the other edge and the second row or perforations; between the two rows of perforations is a center band tear strip. The bands have co-planar upper and lower surfaces. Adhesive is applied only to the bottom surfaces of the first and second band; there is no adhesive on the center band. Bundles of material, such as wallboard, are fastened together by adhering the bottom surface of the first band to the uppermost sheet of material, and by adhering the bottom portion of the second band to the lowermost sheet.

REFERENCES:
patent: 1827636 (1931-10-01), Ames
patent: 4936464 (1990-06-01), Kim

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