Wallboard bundling tape and method

Details Wallboard bundling tape and method Wallboard bundling tape and method

1994-07-11

1995-07-11

Fidei, David T.

Special receptacle or package

For a building component

206451, 229120011, 229926, B65D 8546

Patent

active

054312795

ABSTRACT:
A bundling tape has two rows of perforations extending from one end of the tape to the other; the perforations are arranged inward of and substantially parallel to the edges. A first band is formed between one edge and a first row of perforations, and a second band is formed between the other edge and the second row of perforations; between the two rows of perforations is a center band tear strip. The bands have co-planar upper and lower surfaces. A laminated bundling tape embodiment also has an additional zipper tape attached to the lower surface of the center band, and apparatus and methods are described for making this laminated tape. Bundles of material, such as wallboard, are fastened together by adhering the bottom surface of the first band to the uppermost sheet of material, and by adhering the bottom portion of the second band to the lowermost sheet.

REFERENCES:
patent: 1827636 (1931-10-01), Ames
patent: 3241276 (1966-03-01), Vance et al.
patent: 3854581 (1974-12-01), Jones, Jr.
patent: 4936464 (1990-06-01), Kim
patent: 5087310 (1992-02-01), Robinette

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