Wave transmission lines and networks – Plural channel systems
Patent
1987-07-14
1989-07-25
Gensler, Paul
Wave transmission lines and networks
Plural channel systems
333236, 333243, H01P 500, H01P 306
Patent
active
048517933
ABSTRACT:
A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires. Because the waffle structure has the same periodicity along either of the orthogonal directions of the channels, the characteristic impedance of the transmission link is readily defined by the size of the lands or mesas that are bounded by the channels and the widths of the channels themselves.
REFERENCES:
patent: 3076862 (1963-02-01), Luedicke et al.
patent: 3191100 (1965-06-01), Sorvillo
patent: 4695810 (1987-09-01), Heckaman et al.
Bajgrowicz Edward J.
Frisco Jeffrey A.
Heckaman Douglas E.
Higman Roger H.
Gensler Paul
Harris Corporation
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