Waffle wall-configured conducting structure for chip isolation i

Details Waffle wall-configured conducting structure for chip isolation i Waffle wall-configured conducting structure for chip isolation i

1990-10-01

1991-11-12

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

333251, H01P 308, H01P 1162

Patent

active

050651234

ABSTRACT:
A two-dimensional periodic conductive post array structure is used to suppress higher order wave propagation within a large microstrip housing assembly without attentuating the desired TEM mode of propagation. Substantially vertical conductive posts are spaced at appropriate wavelength periods in the X and Y directions on top of and through a microstrip substrate in a so called "waffle-wall" type configuration. The periodic post structure provides high microwave signal isolation by functioning as a band rejection filter both above the microstrip substrate and within the substrate to isolate between nearby active and passive circuit functions located on the microstrip substrate. The desired TEM mode microstrip transmission line is routed through the conductive post matrix to provide the signal, control and DC paths between circuit chips and other active and passive circuit functions.

REFERENCES:
patent: 3768048 (1973-10-01), Jones, Jr. et al.
patent: 3936778 (1976-02-01), De Ronde
patent: 4268803 (1981-05-01), Childs et al.
patent: 4270106 (1981-05-01), Woermbke
patent: 4480240 (1984-10-01), Gould
patent: 4513266 (1985-04-01), Ishihara
patent: 4547755 (1985-10-01), Roberts
patent: 4605915 (1986-08-01), Marshall et al.

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