Waffle pack

Details Waffle pack Waffle pack

2007-11-12

2011-11-29

Rodriguez, Saul (Department: 3652)

Material or article handling

Process

Reexamination Certificate

active

08066470

ABSTRACT:
An arrangement is described that includes a compartmentalized structure having a multiplicity of compartments defined by associated links and each having a bottom surface. The arrangement also includes a multiplicity of fiducials. The fiducials are positioned at top surfaces of the links that surround each compartment such that each compartment includes at least one associated fiducial at the top surface of an adjacent link that defines the compartment. The arrangement further includes an adhesive layer positioned on the bottom surface of each compartment. The at least one fiducial that surrounds each compartment is suitable for use by a vision system to identify the location of the associated compartment.

REFERENCES:
patent: 5349500 (1994-09-01), Casson et al.
patent: 6067709 (2000-05-01), Godin et al.
Shermer et al., “An Independent Journal Dedicated to the Advancement of Chip-Scale Electronics,” Chip Scale Review, Aug.-Sep. 2001, downloaded Sep. 2, 2007 http://www.chipscalereview.com/issues/0801/techForum02—01.html.
DALSA Corporation “Geometric Search: Accurate Machine Vision in Challenging Conditions,” Machine Vision Online, Apr. 27, 2005, downloaded Sep. 2, 2007 http://www.machinevisiononline.org/public/articles/articlesdetails.cfm?id=2449.
“Chip Carrier™ Chip Protection Solutions,” Epak Electronics Ltd., downloaded Sep. 2, 2007, http://www.epakelectronics.com/aitjedecandwaffletrays.htm.

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