Waferboard structure

Details Waferboard structure Waferboard structure

1994-09-28

1995-07-25

Powell, William

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

216 24, 216 33, 216 39, G02B 600, B44C 122

Patent

active

054369967

ABSTRACT:
A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal struutures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

REFERENCES:
patent: 5268066 (1993-12-01), Tabasky et al.

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