Wafer, wafer polishing apparatus, wafer polishing method,...

Details Wafer, wafer polishing apparatus, wafer polishing method,... Wafer, wafer polishing apparatus, wafer polishing method,...

2009-01-29

2011-11-22

Benson, Walter (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S311000, C451S036000, C451S078000

Reexamination Certificate

active

08063545

ABSTRACT:
To provide a wafer preventing a breakage of a crack or a chip off from being brought about in a polishing step and a polishing apparatus and a polishing method of polishing the wafer, there is provided a wafer in a shape of a plate substantially in an angular rectangular shape used as a raw material of a piezoelectric vibrator. All of corner portions D1, D2, D3, D4substantially in the angular shape are formed in shapes of curved faces by chamfering providing curvatures. The corner portions D1, D2, D3, D4in the shapes of the curved faces at least include a first curved face portion and a second curved face portion chamfered by curvatures different from each other or the same curvature. A reference face of a crystal orientation of the raw material is specified by the first curved face portion or the second curved face portion.

REFERENCES:
patent: 2003/0181141 (2003-09-01), Taniguchi et al.
patent: 2006/0125354 (2006-06-01), Boecking et al.
patent: 2007/0176520 (2007-08-01), Yoshioka et al.
patent: 2008/0120821 (2008-05-01), Ikeda et al.
patent: 2008/0248728 (2008-10-01), Kanaya et al.
patent: 2006-339896 (2006-12-01), None
patent: 2007-184810 (2007-07-01), None

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