Wafer treating method for making adhesive dies

Details Wafer treating method for making adhesive dies Wafer treating method for making adhesive dies

2011-05-10

2011-05-10

Meeks, Timothy H (Department: 1715)

Coating processes

Coating remains adhesive or is intended to be made adhesive

C427S289000, C427S285000, C438S112000, C438S118000, C438S126000, C438S127000

Reissue Patent

active

RE042349

ABSTRACT:
A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.

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